Subject: [Din] EdgeSys open for submission

From: Aaron Ding <[email-masked]>
Date: Tue, 28 Dec 2021 11:25:26 +0000

EdgeSys'22 is open for submissions:
https://edgesys22.hotcrp.com/

The series have been gathering substantial community contributions, especially with high quality TPC, keynotes, panel and technical papers from US, Europe and Asia, including Google, Amazon, Microsoft, Facebook, Intel, IBM, Nokia, Samsung, Toyota, Telefónica, MPI, MIT, Berkeley, Columbia, Yale, UCLA, Cambridge, Imperial, EPFL, TU Delft, TUM, Tsinghua, Peking and Fudan.

Committee and submission guideline:
https://edge-sys.github.io/2022/committee.html
https://edge-sys.github.io/2022/submission.html

Look forward to submissions from DINRG.

Aaron